Used SHINKAWA UTC-3000 #9189019 for sale

SHINKAWA UTC-3000 is a state-of-the-art bonder for connecting substrates and components. It uses a high precision vision equipment, laser height control, and an advanced transport system to precisely bond and solder components onto substrates and create hermetic seals. The vision unit of SHINKAWA UTC 3000 offers high magazine registration accuracy and places components at highly accurate positions. This leads to improved weld quality, as each component is correctly located before bonding. Additionally, the vision machine supports additional manual verify functions, such as marking, needle position control, gap adjust, and others, to reduce errors and increase overall accuracy. The laser height control tool in UTC-3000 ensures that each of the components has the exact same height. This allows appropriate contact area between the parts to be bonded. In addition, the laser height control asset helps ensure that the attachment of the part is done in a way that conserves its total life expectancy. UTC 3000 utilizes an advanced transport technology that accurately and quickly transports components and substrates to the bonding head for processing. This provides high-speed and highly accurate bonding and increases efficiency while avoiding damages to the components. The transport ensures consistently accurate and repeatable performance that helps increase the efficiency of the bonding process and yield. Finally, SHINKAWA UTC-3000 is able to create hermetic seals with a choice of sealing materials. These materials offer both reliable environmental protection and protection against EMI/RFI emissions. This high level of protection from the elements ensures reliability and a long operating life for the bonder. Overall, SHINKAWA UTC 3000 is one of the most advanced bonders currently on the market. Its combination of precision vision model, laser height control, and advanced transport equipment make it one of the most reliable and efficient bonders available. Additionally, its ability to hermetically seal components and protect against EMI/RFI emissions makes it the perfect bonder for challenging environmental conditions.