Used SHINKAWA UTC-3000 #9251980 for sale

SHINKAWA UTC-3000 is an automated wire bonder designed and developed by SHINKAWA, a world leader in precision engineering equipment. This equipment is used in the electronics industry for a variety of applications, such as interconnecting integrated circuits to external systems. SHINKAWA UTC 3000 is an adjustable wafer-level equipment that can process various wafer sizes up to 200mm (8") in diameter. It features an advanced direct drive pattern recognition system that ensures accurate process control and high-quality bonding. The tensioning capability ensures accuracy and repeatability, even with different wire diameters. The unit also features auto-wire stripping, low-profile choice of actuators, and auto size identification. UTC-3000 has a plethora of options for various applications, such as auto mark detection, programmable routing, power optimization, and auto idle stop. The machine also includes an advanced visualization tool with a touchscreen interface and LED that allows operators to monitor processes and control parameters in real-time. UTC 3000 also features an auto wire withdrawal asset that can be used for both single and multiple-wire bonding. SHINKAWA UTC-3000 is a reliable and easy-to-use machine that is designed to meet the highest quality and production requirements of various industries. It comes with a built-in thermal profile generator for fast and accurate production. The model also includes hardware safety features to protect the operator and the machine, such as a door interlocking equipment and an emergency stop button. SHINKAWA UTC 3000 also includes an enhanced motion control unit that is capable of driving up to twelve bond heads and twelve handheld bonders for further flexibility. All of the components are precision-machined and tested for quality assurance. Lastly, the system includes a comprehensive range of accessories, spares, and spare parts to ensure optimal performance of the machine.