Used SHINKAWA UTC-3000 #9285046 for sale

SHINKAWA UTC-3000 is a high-performance bonder, designed to provide reliable and accurate bonding for high-volume applications. This bonder is designed to provide a highly precise form of bonding, and has a range of features to ensure accurate joining and effective product assembly. SHINKAWA UTC 3000 is powered by three axes of motion, and an advanced tension control equipment. It is designed to accurately join components with a highly accurate alignment system and a dual vacuum chucking unit. UTC-3000 uses an advanced algorithm for complex motion control, which ensures uniform and efficient motion throughout the bond process. The automated control machine of the bonder is an industry-leading innovation and designed to optimize productivity and throughput. UTC 3000 is able to perform a variety of bonding types, and is capable of bonding aluminum, copper, steel, titanium and other materials. It is ideal for PCB assembly lines, and is equipped with a laser marker for accurate segmental bonding. The bonder is able to recognize and differentiate between components of varying sizes and bond them accurately. A heated nozzles tool further increases the precision and accuracy of the bond process by precisely controlling the temperature and pressure, to ensure optimal results. SHINKAWA UTC-3000 is equipped with a heated base plate, which is used to form the bond and improve the bond strength. The heated base is designed to reduce thermal bridging and to maximize the bond strength. SHINKAWA UTC 3000 is designed to provide low-maintenance operations and features a hot air cooling, automatic lubrication asset, and an automatic wire feeder. This allows the bonder to effectively bond different types of materials, and to quickly and accurately complete the bond process. The industrial-grade components and a highly tested design of UTC-3000 ensure a long service life, and reliable and accurate results for an array of bonding tasks. In conclusion, UTC 3000 is an advanced high-performance bonder, designed to provide reliable and accurate bonding for PCB assembly lines. This bonder is equipped with industry-leading features such as the advanced motion control, the dual vacuum chucking model, heated nozzles equipment, and hot air cooling system. SHINKAWA UTC-3000 is an effective and reliable bonder, designed to perform a variety of tasks and to consistently provide robust and accurate results.