Used SHINKAWA UTC-3000 #9364792 for sale

SHINKAWA UTC-3000 bonder is an automated precision bonding equipment used to bond a wide variety of materials, including large surface mount components and other substrates. It has a user friendly interface and is capable of handling multiple tasks with a single setup. The system uses a die attach unit to accurately assemble components onto substrates, and uses a combination of thermal and compression bonding techniques to ensure reliable bonding. It features high-precision vacuum suction chuck and is effective in decreasing the amount of adhesive required during assembling. It has different models of chuck for presenting, dispensing and die attach. SHINKAWA UTC 3000 is equipped with a self-diagnostic function and has an automatic shut-off feature if it detects an error in bonding process. The size and resolution of the machine are adjustable to ensure reliable support for even the smallest components. The tool also features an external software kit for efficient remote control and operation. It is provided with a wide range of micro vision asset for accurate process monitoring and a variety of data monitoring tools for process control. In addition, it is equipped with modern safety features such as a dedicated temperature monitor, ESD protection, vibration sensors, and a three-layer protective coating to ensure trouble-free operation. It can also be integrated with other automation systems to create a fully automated production line. UTC-3000 is used in various industries for applications such as die attach and vacuum bonders for semiconductor fabrication, die leveling and other assembly processes. It is the ideal solution for companies looking for an automated, cost-efficient and accurate approach to bonding and assembling various components.