Used SHINKAWA UTC-3000 #9376007 for sale

SHINKAWA UTC-3000 bonder is an advanced high-speed bonding machine designed for use in the microelectronics manufacturing industry. It features a maximum bond speed of 2,000 points per second, making it one of the fastest bonders in its class. SHINKAWA UTC 3000 is also capable of applying precise and fine-line bonding techniques, making it a highly versatile solution for a wide variety of applications. The bonder is equipped with a 3-axis control system and programmable substrate stage for precise operation, allowing users to accurately move and place substrates and bond components on the device. The device also includes an onboard camera, allowing users to inspect and diagnose bond quality during the bonding operation. In terms of power consumption, UTC-3000 runs on a single phase line voltage with a phase angle of 0, making it one of the most energy efficient bonders in its class. The device also has a built-in console with touch screen interface, allowing users to quickly and easily recall bond patterns, control bond pressure and other bond settings. UTC 3000 also includes an impressive range of safety features, making it one of the safest devices of its type. An emergency stop button, electric-monitoring input system, light-curtain system, and vibration isolation table are just some of the safety features included on this device, protecting the user from potential hazards. SHINKAWA UTC-3000 is a top-of-the-line bonding machine, offering a wide range of features and capabilities. It is capable of performing precise and fine-line bonding techniques, and its energy efficiency, safety features, and ease of use make it an excellent choice for the microelectronics manufacturing industry.