Used SHINKAWA UTC-310 BI #9260647 for sale

SHINKAWA UTC-310 BI is an automated ultrasonic bonder that is perfect for bonding and cutting a variety of materials including polyester film, laminates, paper, metal, fabrics, foil and more. With a maximum throughput of up to 650 mm/s, UTC-310 BI is a highly efficient bonder for a wide range of applications. At the center of SHINKAWA UTC-310 BI is a high-performance microprocessor that manages the motion and timing with precision. This ensures a high degree of repeatability and accuracy during bonding and cutting cycles. The control system boasts a user-friendly operating interface, making it easy to program complex jobs quickly and accurately. The bonder includes a rotary cutting head and / or dieless cutting head for the highest precision cutting edges. UTC-310 BI has both manual and automated operation options, allowing operators to switch between manual and automatic modes with ease. In addition, SHINKAWA UTC-310 BI includes a built-in safety mechanism to prevent damages in case of an emergency. UTC-310 BI offers an ultrasonic Processe Console, which provides a range of pre-programmed operating paramenters to optimize the Bonding and Cutting processes. This console also displays the status of the bonding/cutting processes in real time, including temperature, force, power and other details. Additionally, operators can customize bonding parameters for different materials and speed up the setup time. Finally, SHINKAWA UTC-310 BI has a built-in automatism for efficient operation, helping to reduce costs and stress on the operator. This automatism includes seam sensing, force control, gap adjustment, arc control etc., making it user friendly and energy efficient. For companies looking for a reliable, cost-effective, and precise bonder, UTC-310 BI is a great choice. With its reliable microprocessor, advanced control system, user-friendly interface, and built-in safety features, SHINKAWA UTC-310 BI is a perfect solution for industrial and commercial applications.