Used SHINKAWA UTC-310 BI #9260661 for sale

SHINKAWA UTC-310 BI series of bonders is a precision automated wire and ribbon bonding machine developed by SHINKAWA Electric Works. This machine is specifically designed for the bonding of fine wires and ribbons with a constant force and a variety of bond lengths. UTC-310 BI series bonders are capable of applying wire and ribbon bonding forces ranging from 1.2N to as high as 30N and offer a very precise wire and ribbon bonding process because of the consistent force output each time. The bond length can be precisely set for each wire or ribbon, allowing the user to create bonds with a range of lengths to meet the particular needs of their application. The bonder has a user friendly control panel that is easy to understand and use. The control panel allows you to directly set the wire and ribbon bond parameters such as the bond pressure, speed, and length. In addition, the bonder can be used with the same parameters for different bond types, size, and materials. SHINKAWA UTC-310 BI series of bonders is well-suited for PCB manufacture as well as microelectronic apps, due to its compact size and light weight. This bonder has an integrated AC servo drive and motor, which reduces cost and saves space. The wide range of bond lengths available ensures that it can be used in a variety of different applications. The bonder is durable and long lasting, with an expected life of up to 30,000 hours. With a wide range of additional accessories and tools included in the purchase, the bonder is flexible and easy to set up. It also has a low noise level, making it ideal for a lab or any other office environment. In conclusion, UTC-310 BI series of bonders is an ideal choice for precision wire and ribbon bonding applications, thanks to its reliable performance, high accuracy control, and its cost-effective pricing. With its user-friendly interface, wide-range of bond lengths, and low noise level, this bonder is great for a variety of manufacturing tasks.