Used SHINKAWA UTC-370 BI #9352203 for sale

SHINKAWA UTC-370 BI is a state-of-the-art wire bonder manufactured by Japanese electronic device manufacturer, SHINKAWA Electric. This high-end, industrial-strength machine is designed specifically to provide superior accuracy, speed, and convenience in the production of microelectronic assemblies. UTC-370 BI is equipped with a range of advanced features that make it an excellent choice in the electronics industry. Its two-station design allows for simultaneous processing of both single- and double-point wire bonds. It supports a wide range of bonder types, including ultrasonic, thermocompressive, and thermowelding machines. Moreover, its advanced wafer inspection system is triple precision, ensuring the highest quality for a variety of microelectronic components. SHINKAWA UTC-370 BI provides an impressive degree of flexibility when it comes to both material and wire size. Made of cast aluminum and stainless steel, it supports beryllium copper alloy wire in a range from 0.002" to 0.012" (0.0508mm to 0.3048mm). It is also equipped with a touchscreen interface that offers a user-friendly experience and an intuitive graphical user interface that is easy to understand. In addition, UTC-370 BI features a unique "Ion-beam Activated Self-Alignment Cutting System." This sophisticated technology utilizes a precise beam of ions to accurately and consistently adjust the wire tension and settings required for optimal cutting performance. The result is a consistently high-quality bond that requires only minimal wire manipulation. Finally, SHINKAWA UTC-370 BI includes a range of advanced safety features that ensure a safe and secure working environment for the operator. Its auto-shutdown feature protects both the machine and its surroundings from damage resulting from overheating and other causes. Additionally, the machine features various levels of protection against excessive pull force and jamming, allowing for maximum productivity with minimal risk. All in all, UTC-370 BI is an outstanding choice for the production of reliable microelectronic products. Its powerful, reliable features offer an expanded degree of flexibility and accuracy when creating high-quality bonds for a variety of applications.