Used SHINKAWA UTC-380 BI #9160104 for sale

SHINKAWA UTC-380 BI is a highly advanced wire and thermocompression bonding equipment designed for the production of ultrafine and complex electrical assemblies. It is an all-in one system that combines precision bonding technology with high speed and accuracy, making it an ideal solution for challenging and fine bond processing tasks. UTC-380 BI features a three-axis dual head unit. This enables the user to link any two subassemblies at one time for a repeatable, high-precision assembly. The machine's bonding head is engineered with a 400 watt laser that delivers fused, repeatable bonds in a fraction of a second. The machine also features a vacuum pick-up tool for automated and precision placement of small parts, ensuring accurate bonding even at extreme scales. SHINKAWA UTC-380 BI offers a range of adjustable parameters to facilitate optimal bonding. These parameters include heating temperature, dose output, and current flow. All settings can be modified on the machine's main user interface. Users can also create and save custom settings profiles for specific jobs, further improving tool efficiency and accuracy. UTC-380 BI operates in both manual and automatic modes. The manual mode allows users to alter the bond parameters and verify alignment of the parts, making this machine perfect for prototyping small-scale electronic components. For larger scale and high volume production applications, the automatic mode allows for hands-off operation. SHINKAWA UTC-380 BI provides unparalleled accuracy and quality assurance factors for fine wire bonding applications. Its integrated laser vision asset and auto-wire feeder ensure consistent output, and the model has a built-in equipment for hard failure detection and quality assurance monitoring. Finally, UTC-380 BI is designed for a versatile range of substrates, and is compatible with a wide selection of bonding materials, such as gold, copper, silver, aluminum, and solder.