Used SHINKAWA UTC-400 BI Super #9236418 for sale

SHINKAWA UTC-400 BI Super is a highly-accurate, easy to use bonding machine designed to meet the expansive needs of the electronics industry. This advanced, automated device is used for multi-layered and intricate bonding applications, specifically for the integration of large-scale electrical components. With its streamlined integration of both traditional and more contemporary technologies, UTC-400 BI Super is capable of providing superior performance in a variety of applications. SHINKAWA UTC-400 BI Super boasts a range of features and capabilities to ensure the highest quality of bond strength. To start, this bonder is equipped with a wide range of bonding nozzles that offer multiple mounting options for top and bottom-side components. The nozzles are available in both round and rectangular shapes to cover a broad range of parts size. Additionally, a fine-tip version allows for precise placement of difficult to reach connectors. UTC-400 BI Super also features a high-precision, double-arm drive mechanism providing a smooth, even motion with no stutters during operation. An adjustable speed control ensures perfect bonding performance with every application. SHINKAWA UTC-400 BI Super utilizes thermoplastic welding technology that applies heat to the components that must be bonded together. This ensures accurate bonding and temperature control to the very degree of the bonding process. The bonder also has automatic fluxing capabilities that deter against oxidation and facilitate the bonding process. It makes use of a high-pressure jet air system to ensure proper fluidization and bond strength. All of these features work together to ensure consistent bonding and high-tolerance levels. Finally, UTC-400 BI Super has a high-end, drag-and-drop software interface that makes it easy to design and configure the bonding parameters. The software enables users to monitor, modify, and store current and past production data and configurations right at the touch of a button. With such a robust selection of features, SHINKAWA UTC-400 BI Super is changing the way the electronics industry handles multi-scale bonding with ease and accuracy. Its intuitive design and versatile capabilities make it the perfect choice for simple or complex bonding applications.