Used SHINKAWA UTC-400 BI Super #9242429 for sale

SHINKAWA UTC-400 BI Super is an advanced high-performance bonder for joining and assembling electronic components. It is a high-speed, low-cost and reliable solution for soldering and connecting components in the electronics industry. UTC-400 BI Super is an automated active soldering device that offers superior performance and efficiency for companies that require precision and high quality. The device features a bonded area of 1.6 mm, a 20 kHz process frequency and a programmable temperature range of 200°C to 400°C. The hot process temperature and time can be quickly and accurately controlled. SHINKAWA UTC-400 BI Super is equipped with an ergonomically designed workstation with a user-friendly interface. The adjustment functions have been optimized for easy operation. The device has a quick dip function that enables simple and easy soldering process and eliminates the need for multiple manual tools or additional setup. UTC-400 BI Super also provides excellent cooling capabilities with active cooling fans. These fans help to reduce the heat generated by the soldering process, saving energy and preventing component destruction. The design also minimizes maintenance efforts as the components are resistant to corrosion and other environmental stress factors. Finally, the device offers a wide range of accessories. A scanning probe, a precision tip and a special soldering additive are available as optional extras. These extras will optimize the soldering process, allowing for efficient, repeatable and accurate operations. With a global warranty and an extensive service network, SHINKAWA UTC-400 BI Super is an ideal device for the soldering needs of today's electronics industry.