Used SHINKAWA UTC-400 BI #148657 for sale

SHINKAWA UTC-400 BI is a precision bonder designed specifically for the manufacturing and assembly of electronic parts. It is capable of producing reliable, dependable solder assemblies for a wide range of industrial applications. UTC-400 BI can operate either as a stand-alone bonder, or in a system with a variety of other components. SHINKAWA UTC-400 BI is designed for high accuracy and stability—featuring a reliable drive system, an easy to use software interface, and an adjustable distance between jaws for multi-aspects in size. Its two durable arms and ground-level anti-static carriage provide a low thermal shock and even surface heat distribution. UTC-400 BI is compatible with a wide range of substrates and materials, including: lead-free, gallium alloys, Pb-free solders and various other alloys. SHINKAWA UTC-400 BI features three separate power sources: direct power, AC current, and pulse power. This gives the user greater flexibility when setting up the machine, allowing for different levels of heat, temperature control, and speed. The machine also has an Ethernet port, which allows for remote control over the device, including the adjustment of settings. The main feature of UTC-400 BI is its ISO 9001:2008 and ASME certified, self-contained solder bath. This feature ensures a robust, uniform bond on a range of materials, including: glass, ceramic, and low-k materials. In addition, the machine's digital thermocouples provide accurate temperature measurement in real-time. SHINKAWA UTC-400 BI is a highly capable device with a number of operational features, such as a 25mm ceramic-tip bonding jaw and a fast-cooling function for both low-k and gold plated substrates. The machine's semi-automatic modes provide advanced automation and increased assembly repeatability, with options for either manual or automatic welding. The device also features an integrated autoclave chamber, designed to efficiently clean and degas components. Furthermore, it has an automatic programmable solder profile, designed to ensure faultless results with each bond. In short, UTC-400 BI is a highly accurate and reliable bonder, designed for industrial electronic applications. The device provides multiple power sources, a self-contained solder bath, a fast-cooling function, digital thermocouples and an automated autoclave chamber, allowing for a greater degree of control and flexibility when bonding parts. Furthermore, the machine's semi-automatic modes and programmable solder profile ensure that each bond is consistent, while its easy to use software interface allows for easy setup and operations.