Used SHINKAWA UTC-400 BI #293629379 for sale

SHINKAWA UTC-400 BI is a highly advanced bonder machine developed by SHINKAWA Corporation. This machine can be used for a variety of tasks, such as die bonding, flip chip, chip-on-board, and wire bonding. UTC-400 BI has several advanced features, such as a wide variety of quantitative temperature control parameters, as well as carrying out wire bonding and die bonding with accuracy and precision. This machine is designed for easy operation and a user-friendly interface. Additionally, this bonder machine is equipped with a proprietary vision equipment, allowing it to accurately detect the size, shape and location of the chips to be bonded. SHINKAWA UTC-400 BI has a built-in bonding force detection system, and it can detect both "cleaner" and "crazier" chip connections with air relative to conventional methods. As a results, the bonder can operate more accurately regardless of the application. The force detection unit is also capable of detecting the dynamic characteristics of the wire bonding, allowing UTC-400 BI machine to detect loops and wire conditions in real-time and adjust accordingly. SHINKAWA UTC-400 BI has four bonding angles: 90, 180, 270 and 360-degrees. This provides maximum flexibility for the application. Furthermore, due to its patented tool-teaching machine, the machine is able to feed the chips, caps, and bezel in an organized manner regardless of the skill level of the operator. Therefore, the process is completed in a shorter period of time, along with an enhanced quality of the chips being bonded. The machine also allows for mounting of various types of bonding tools and provides alignment of the tools in both the X and Y directions. This enables the machine to bond without interruptions and in a highly efficient manner. UTC-400 BI also has a cooling tool that helps dissipate heat generated during the bonding process, ensuring the chips are not damaged. Overall, SHINKAWA UTC-400 BI is a highly efficient, accurate, and reliable bonder machine. It is suitable for a wide range of applications and its advanced features make it well suited for small to medium size projects. The machine comes with a wide array of built-in safety and monitoring features, making it more secure to operate.