Used SHINKAWA UTC-400 #155275 for sale

SHINKAWA UTC-400 is a state-of-the-art precision bonder. It is a high performance equipment for high-precision lap joining, particularly suited for production of thin-film components. With features including an easy-to-operate design, this system is designed to meet the very highest standards of accuracy and repeatability. SHINKAWA UTC400 bonder offers a comprehensive range of innovative features to ensure efficient and reliable operation. The unit uses advanced vision technology to ensure accurate alignment of parts in the bonding process. This ensures that optimal bonding results are achieved each time and unwanted voids are minimized. The unique thermal control machine of UTC 400 ensures accurate control of liquid and semi-solid materials. This ensures consistent results and repeatability for production use. The integrated optical fiber transceiver enables real-time temperature feedback, providing continuous process control. UTC400 also features a range of safety and protection features. This includes a sophisticated over-temperature protection tool that limits heat energy levels by ceasing the heating process before bonds are damaged. Designed to minimize environmental impact, the asset automatically reduces waste by preventing overheating. The versatility of SHINKAWA UTC 400 provides excellent flexibility with a wide variety of application possibilities including adhesive bonds, solder bonds and temperature curing. The heavy duty thermoplastic clamping plate securely holds both parts in place during the entire bonding process, ensuring even pressure distribution. UTC-400 bonder has been designed to meet the requirements of challenging production tasks and is suitable for a variety of industries. With features including accurate and repeatable bonding, over-temperature protection, waste reduction and automated thermal control, SHINKAWA UTC-400 is an invaluable asset for any production environment.