Used SHINKAWA UTC-400 #9110442 for sale

SHINKAWA UTC-400 precision bonder is a versatile tool used in industries like electron microscopy, medical device manufacturing, and precision bonding of materials. Utilizing active feedback control and an intuitive user interface, this state-of-the-art bonder offers users superior bonding performance and precision. At its core, SHINKAWA UTC400 bonder uses a closed-loop pressure and temperature control system for micro-bonding applications. A high precision load cell which provides 0.1gf accuracy ensures accurate, repeatable fine-bonding operations. Additionally, an atomizer makes it possible to precisely control the bond area size. The bonder is also able to de-liver/withdraw a specific amount of current while measuring and controlling the temperature of the pressurized portion of the unit. UTC 400 bonder also comes equipped with a vision system to ensure alignment accuracy and is able to mount wafers or units as large as 27mm in size. Furthermore, its large-volume hot chamber is capable of bonding tough materials such as stainless steel and titanium. Its intuitive user interface makes the operation of the unit easy, even for operators that are not familiar with the technology. UTC-400 bonder is a cost-effective solution for laboratories, production lines and other areas where precise bonding is required. All these features combine to make UTC400 bonder one of the most advanced, precise, and versatile bonders on the market. Its sophisticated closed-loop pressure, temperature, and current systems make it an ideal choice for demanding applications.