Used SHINKAWA UTC-400 #9155929 for sale

SHINKAWA UTC-400 is a high-end automatic bonding equipment designed for producing high-precision products for various industrial applications. The system incorporates an integrated CCD camera, with a high resolution image processing engine and a precise motion control algorithm, allowing for accurate component positioning and bonding. SHINKAWA UTC400 is equipped with a novel 3D bonding head designed to apply a variety of bonding materials including silver paste, alumina powder, solder balls, gold wires, and conductive epoxy. UTC 400 is capable of bonding components as small as 0.4mm with high precision alignment and reliable consistency. Compensating for component tolerances is made simplae with UTC-400 integral X-Y axis stages for stage movement. The unit is easy to program with the auto-programming feature, which requires inputting of some parameters and the bonding coordinates on the LCD touch panel. In addition, UTC400 offers a range of accuracy and traceability features including 3D non-contact measurement, contactless release force measurement, and high-speed measurement with expanded XY range access. This allows for accurate component orientation, precise mechanical adjustments, and precise force control handling for efficient production. SHINKAWA UTC 400 machine is suitable for bonding of miniature components in smartphones, medical devices, automotive systems, and other industrial settings. Combined with its ability to bond different types of materials, SHINKAWA UTC-400 is a powerful bonding machine for high precision applications. The intuitive user interface, comprehensive programming and control features, and high-precision bond heads make SHINKAWA UTC400 a reliable and efficient choice for automated bonding applications.