Used SHINKAWA UTC-400 #9223881 for sale

SHINKAWA UTC-400 is a precision bonding equipment that is designed for the creation of high-precision waveguide and alumina substrates. SHINKAWA UTC400 is capable of providing both manual operation and automated bonding through either batch or continuous modes. UTC 400 is a fully automated bonder, equipped with a precision motion control system and integrated camera unit for precise bonding of targeted waveguide and alumina substrates. It is equipped with variable flow nozzles, a gas monitoring machine, vacuum table, IR heating and cooling systems, precise electrical resistance welding, and auto-clamp and release functions. It also features an automated workpiece transfer tool, allowing for precise and repeatable placement of the substrate. The machine works by using the vacuum table to hold and position the substrates, while the nozzles spray the welding electrode in a fine line on the metal material being welded. The heating asset then facilitates a controlled heating of the metal material. The welding machine then pulses a current through the electrode and metal substrate, which causes a fusion between the two materials. The IR cooling model then helps cool down the material for a faster and more efficient process. UTC-400 also features a range of safety and automation functions to ensure that the process is controlled correctly. This includes a self-diagnostic equipment to alert users of any mechanical breakdowns or faults in the machine. Additionally, the machine also features various productivity settings options such as power adjustment, inspection and welding results monitoring, and arc monitoring to ensure that the bond is being created at an optimal level. Overall, UTC400 is a highly advanced and precise bonding system capable of creating waveguide and alumina substrates with exceptional accuracy and speed. Its range of automation and safety features make it a reliable and user-friendly machine for those working with waveguide and alumina materials.