Used SHINKAWA UTC-435 #9110441 for sale

SHINKAWA UTC-435 is a precision wire bonder used in semiconductor device manufacturing. It is designed to create high-quality, reliable wire bonds between semiconductor die and leadframes. UTC-435 features a bonding head that has two independently adjustable bonding arms for accurate placement of the bonding media. Each arm can be independently adjusted to create a custom bond pattern. The bonder also includes an intelligent adjustment equipment that can compensate for variations in the wire size, ensuring that the most accurate bond is created possible. SHINKAWA UTC-435 features a rotary bond head that features an optimized force loop to provide consistent wire bond strength and prevent potential breakage during the bonding process. It has a heavy-duty linear-motor driven actuator for swift motion and improved accuracy. The bonder also has two high-precision XYZ stages that independently control the wire size and position, ensuring the exact wire length is used for each bond. The stages also allow for custom angled bonds, offering the greatest versatility for the device. UTC-435 also incorporates a uniform thermal profile to provide even heat distribution across the bond. This allows the bonder to be used without excessive wire heating, providing safer and more consistent bonding. The bonder also features an automated wire feed system that minimizes material waste and increases process efficiency. SHINKAWA UTC-435 comes with safety features that protect both the user and other components during use. This includes an interlock unit for controlling leadframe movement, and a safety guard cover that prevents accidental contact with the bonder. The bonder also has a fail-safe feature that ensures that the bond is completed correctly, even if the bonding operations fail before completion. UTC-435 is an efficient, reliable, and accurate bonder that can provide high-quality wire bonds. Its precise adjustment machine, uniform heat distribution, and safety features make it an ideal choice for semiconductor device production.