Used SHINKAWA UTC-435BI #9110443 for sale

SHINKAWA UTC-435BI Ultrasonic Wire Bonder allows for precise bonding of microelectronic components onto substrates through the use of ultrasonic transducers. With its sophisticated design and intelligent features, this bonder is a powerful tool for any electronics manufacturer. UTC-435BI features an ergonomic design and an intuitive user interface for maximum operational efficiency. The easy to use touchscreen control panel allows operators to adjust the welding process with precise settings. The machine's X-Y scanning mechanism ensures precise placement of each component, while its multi-effect ultrasonic transducer system eliminates potential cracks or chip damage. In addition to its advanced features, SHINKAWA UTC-435BI features industry-leading bond strength. Its patented ultrasonic technology uses heat generated from oscillation to form strong bonds without sparking or electrical damage. The bonders ultrasonic system also offers higher quality control and consistency of welds compared to traditional bonding methods. To further minimize operator fatigue, UTC-435BI offers laser-guided wire feeding and automatic wire loading capabilities. For ultimate accuracy, it also comes with a high-precision, digital closed-loop controller which allows for exact positioning of the wire. SHINKAWA UTC-435BI bonder is an outstanding choice for any electronics manufacturer looking for superior performance and cost savings. With its advanced design, intuitive operation, and industry-leading performance, this bonder makes a great addition to any manufacturer's production line.