Used SHINKAWA UTC-470 BI Super #9236419 for sale

SHINKAWA UTC-470 BI Super is a high-end, automated, thermocompression bonder. Designed for use in a variety of different applications, the bonder is able to form strong joints in metals, ceramics, and printed circuit boards (PCBs) and can accommodate a variety of substrate and bonding materials. The bonder utilizes a combination of heat, pressure, and time to form a strong bond between substrates, creating a robust, hermetic seal. The bonder features a highly controllable atmosphere chamber, allowing for the creation of ideal conditions for a variety of bonding operations. A thermal baffle equipment enables temperature uniformity in the chamber; while an infrared temperature monitoring system ensures that temperature variations in the chamber remain within tight tolerances. The atmospheres in the chamber can be controlled to optimize the size, speed, and precision of the bond. UTC-470 BI Super also utilizes linear heaters on the underside of the heating plate, ensuring the fast and uniform heating of substrates. The overall heating process is controlled by PID control (proportional, integral, and differential control) technology, a feedback loop unit for temperature and pressure control. The bonder also incorporates a dual-sensor machine to ensure proper alignment of substrates prior to bonding. Accelerometers are used to monitor vibration and acceleration during bond formation, allowing for the attainment of precise bond pressure. The bonder is operated by a user-friendly color-touchscreen, offering a wide variety of features including customizable user menus, data input/output, and secure login. SHINKAWA UTC-470 BI Super is capable of storing up to 30 programs for future use, helping to improve product reliability and process efficiency. Overall, UTC-470 BI Super is a high-performance bonder designed for precision and reliability. With its combination of advanced features and ease of use, the bonder is an ideal choice for creating reliable hermetic seals for a variety of applications.