Used SHINKAWA UTC-475 BI Super #9159204 for sale

SHINKAWA UTC-475 BI Super is a state-of-the-art bonder designed for applications requiring ultra-precise bonding and screen protection. Its specialized bonding technology is compatible with both single-sided and double-sided circuit boards, and its advanced metalization processes offer maximum coverage and optimal electrical contact. The bonder also features a laser beam printer and advanced image processing algorithms to ensure sharp and precise screen printing. UTC-475 BI Super is compact yet powerful, reducing the size and complexity of production lines. With an integrated AC drive and corrosion-resistant stainless steel frame, the bonder provides reliable performance and reliability. Its ergonomic design includes a detachable head that makes it easy to switch out components for rapid maintenance and adaptability. SHINKAWA UTC-475 BI Super also features a unique 3-point floating mechanism which helps to avoid wear and fatigue, resulting in higher bond rates and enhanced life-cycle performance. The bonder also features adjustable displacement sensors to ensure precise image registration, while its advanced line width control allows users to achieve higher speed bonding and superior adhesion. To maximize safety, UTC-475 BI Super features an integrated single-layer finish to prevent interference from electromagnetic fields. The bonder also includes a range of safety features, such as an FSP-compliant cover safety system and pressure-sensitive safety guard. The built-in error detection system helps to ensure the bonder is safely operating within standard limits. This innovative product offers quality and precision to create a superior product. Its advanced engineering and custom design provide maximum flexibility and performance for any application. With its high-speed and accuracy, SHINKAWA UTC-475 BI Super is an ideal choice for fast production and reliable bonding.