Used SHINKAWA UTC-475 BI Super #9236420 for sale

SHINKAWA UTC-475 BI Super is a state-of-the-art industrial bonder that provides superior bond strength and accuracy for industrial applications. This machine is equipped with industry leading bonding technology, making it a top choice for a variety of industries. UTC-475 BI Super offers reliable and consistent bonds, even with highly demanding requirements, and it is suitable for a wide range of materials, including metals, ceramics, plastics, and glass. SHINKAWA UTC-475 BI Super features a high-quality HD (High Definition) video imaging equipment that provides enhanced image resolution and a variety of magnification settings for viewing and manipulating the key process elements to ensure high precision and excellent processing quality. It offers an ergonomic design, allowing for comfortable operation and easy access to all areas of the impact area. The bonder features an advanced High Frequency (HF) micro-electric field pattern generation system that supports high-speed and uniform welding on almost all electric fields and provides an ideal welding pressure performance. It includes a full range of welding shapes and other component detection technology that can be used to accurately detect and identify all welding components. UTC-475 BI Super utilizes an advanced, highly-sensitive temperature control unit that ensures accurate temperatures are maintained throughout the processes. This machine offers precise temperature control for both pre and post welding, ensuring the highest-quality results for every bonding job. SHINKAWA UTC-475 BI Super also features a tool for auto detection of parallelism and area size. This ensures that the weld material is applied in a uniform manner with maximum coverage and consistent matching of the bond line. Additionally, the bonder is equipped with exclusive self-cleaning and dust cleaning systems to maintain accuracy and safety during process operation. Last but not least, UTC-475 BI Super features a high-speed pattern recognition asset that automatically identifies bond points accurately and quickly. This model helps to reduce the time required for material preparation, handling and bonding. Ultimately, SHINKAWA UTC-475 BI Super combines superior precision, advanced technology, and high-quality components to provide users with the highest-quality bond solutions.