Used SHINKAWA UTC-475 BI Super #9260766 for sale

SHINKAWA UTC-475 BI Super is a bonder made by one of the world's leading manufacturers of bonding equipment. It is designed for use in manufacturing processes ranging from industrial and automotive to aerospace and energy. The bonder utilizes an advanced ultrasound transducer technology to ultrasonically bond various materials together. The bonder features powerful pulse technology which produces an instantaneous surge of energy that quickly bonds materials together with a high-strength, durable bond. Utilizing a hot melt technique, UTC-475 BI Super utilizes heat to combine materials into a cohesive bond even during high production rates. The hot melt process ensures a strong, reliable bond even when the materials may be thin or dissimilar. The bonder also has a built-in thermal protection to prevent any damage to adjacent parts or components due to adhesion heat when the bond is being formed. The bonder is capable of bonding a wide range of materials such as plastics, metals, and alloys. SHINKAWA UTC-475 BI Super features a wide selection of bonding parameters, allowing the user to customize the bonding process to achieve their desired results. The unit also supports a wide range of materials including a variety of plastics and epoxies, as well as ultra thin materials including metals, substrates, and semiconductors. In addition to its wide range of materials, UTC-475 BI Super is capable of providing a high degree of accuracy, repeatability, and stability during the bonding process. The unit ensures consistent performance thanks to its state-of-the-art digital controls for controlling the speed, power, and frequency of the bond process. The advanced digital control system also allows for total monitoring and control of the entire bond process, giving the user complete assurance of quality. Overall, SHINKAWA UTC-475 BI Super is an advanced, advanced bonder that is reliable, accurate, and efficient. The unit is capable of bonding a wide range of different materials with a high-strength bond and is equipped with advanced digital controls to ensure consistent quality in every bond produced. The bonder provides users with an intuitive interface and a wide selection of parameter settings to get the best results in every application.