Used SHINKAWA UTC-475 BI #116262 for sale

SHINKAWA UTC-475 BI (Bonder) is a highly precise and specialized assembly machine designed for quality electronic and semiconductor packaging and bonding. This machine was designed to work with a variety of materials with high accuracy and repeatability, making it the ideal solution for production in high volume with small precision components. UTC-475 BI features a precision process algorithm that consistently delivers precise results. It is capable of delivering up to 50 bonding cycles per minute using a variety of ultrasonic welding, laser welding, and metal braze welding methods. Its precise process algorithms also ensure precise placement of components during assembly. The machine includes an advanced temperature control system that maintains precise temperatures throughout the whole assembly process. This ensures precise control of temperatures throughout different bonding steps. Its on board computer enables it to perform various functions such as diagnostics, programming, high speed mode, cycle time optimization, and process data collection. The vacuum chuck is designed to securely hold small components in place during the process, allowing it to secure any miniaturized components with ease. SHINKAWA UTC-475 BI has an intuitive touch screen interface along with a standard graphical user interface (GUI). This makes operating and programming the unit easy and efficient. Additionally, the machine has wifi capability, making it suitable for remote monitoring, remote process control and diagnostics. UTC-475 BI is also capable of both in-line and off-line installation processes. This allows the machine to be easily incorporated into existing production lines, and to process multiple components. It also allows the machine to be easily moved should the production lines or processes for the production line change. Overall, SHINKAWA UTC-475 BI is an ideal solution for high volume production of high precision components for a variety of industries. Its intuitive user interface, advanced temperature control, process algorithm, and wifi capability make it a simple and efficient bonder for all production requirements. Its small size, versatility, and highly precise results make it a top of the line bonder suitable for any process.