Used SHINKAWA UTC-475 BI #9069036 for sale

SHINKAWA UTC-475 BI TSEP bonder is a high-precision, fully automated thermosonic gold ball bonder. It is designed for thermosonic gold ball and wedge bonding applications in a wide range of industries. This bonder is ideal for applications such as microelectronic packaging, MEMS and IoT devices, and is specifically designed to meet the most exacting industry standards. UTC-475 BI bonder utilizes an innovative design that incorporates an 8-head rotary bonder head and 5-axis motion that enable the bonder to bond precision micro-connections with greater accuracy and repeatability. Each bonder head is equipped with a customized bonding arm that can be adjusted for optimal alignment for each of the set-ups. This arm is equipped with a moveable finger pattern that enables the bonder to bond different bonding configurations and sizes. In addition, the bonder is equipped with a Vision Alignment Equipment (VAS) that ensures the highest degree of accuracy and repeatability for each bond. This system utilizes a combination of backlighting techniques, a camera, and a laser unit to precisely align and measure each bond. The combination of these three components allows the bonder to detect any misalignment between the ball bonds and the gold joints in real time. SHINKAWA UTC-475 BI also offers a wide variety of settings to customize the bonder to the user's specific needs. The machine can be programmed to bond various ball sizes, bond lengths, take variable bond angles and promote uniform hot spots. It also offers quick programming and a 17 degree cone-shaped hole pattern for bonding tens of thousandths of an inch (0.000001") thick gold ribbon. The low-workload, high-efficiency bonder also features an adjustable bonding force and a digital touch screen for easy operation. UTC-475 BI TSEP bonder is a top-of-the-line thermosonic gold ball bonder that offers the highest degree of accuracy, repeatability and performance. With features such as a Vision Alignment Machine, adjustable bonder head, and a wide range of settings, this bonder is the perfect choice for any microelectronic packaging and MEMS application.