Used SHINKAWA UTC-475 BI #9223882 for sale

SHINKAWA UTC-475 BI is a precision hybrid bonder with excellent temperature and force control, capable of handling a wide variety of thermoplastic bonding tasks. At its core is a high-precision microprocessor combined with fully-digital inputs, capable of precise control of the bonder's motion. UTC-475 BI utilizes a unique triple-coil design to provide three separate heating zones, with individual control of temperature for each. The large XY stage provides speed and accuracy, with easy-to-use toggle and joystick operations for precision positioning. The four-axis design allows for intricate work while maintaining an accurate, responsive bond. SHINKAWA UTC-475 BI is also equipped with an integrated adhesive dispenser that accurately dispenses precisely-measured bond adhesive for even coverage and quick application. The forced air fan assists the dispenser to cool the adhesive before the bond is formed, ensuring a strong, secure bond with no risk of adhesive degradation. For safety, UTC-475 BI is equipped with a built-in thermal fuse. This device monitors the temperature of the bonding process and will shut down the machine if it overheats due to prolonged use or an error. The unit is also covered by a two-year warranty for peace of mind. SHINKAWA UTC-475 BI is perfect for the most delicate plastic or composite bonding applications. Its precise temperature and force control, as well as its automated adhesive dispenser, make it well-suited for creating bonds that are as strong as they are secure. Thanks to its superior design and control, SHINKAWA UTC-475 has become a go-to choice for many manufacturers in the field of thermoplastic bonding.