Used SHINKAWA UTC-475 #9155498 for sale

SHINKAWA UTC-475
Manufacturer
SHINKAWA
Model
UTC-475
ID: 9155498
Wire bonder.
SHINKAWA UTC-475 is a versatile and reliable ultrasonic bonder designed to meet the needs of a wide variety of applications. UTC-475 offers a highly efficient bonder platform with excellent bonding and forming performance. The unit utilizes a high-intensity, advanced ultrasound transducer equipment, along with an intuitive control system, to generate and control the sound waves needed for high-quality bonding. Its flexibility and high-performance capabilities make it an ideal choice for applications such as wire and cable assemblies, electrical insulation materials, circuit boards, and medical devices. SHINKAWA UTC-475 features a highly reliable and easy-to-use control unit. Its 3-axis feedback loop controls the power transmitted to the transducer, generates wave shapes to meet the specific requirements of the application, and provides real-time monitoring of the bond. The energy transmitted to the transducer can be accurately monitored and managed to maintain a consistent bond. The control machine is powered by a reliable servo motor and is designed to operate within very tight tolerances to ensure consistent high quality results. UTC-475 is capable of operating at peak power outputs ranging from 5 W to 55 W, allowing for flexibility in a wide variety of applications. Additionally, its high-intensity transducer tool allows for a wide range of sound waves to be generated, providing a high degree of accuracy and control for automated and manual bonding processes. SHINKAWA UTC-475 also features a wide range of attachments and fixtures to further customize the Bonding process. This includes manual or automatic assembly fixtures, guide rods, and various other fixtures all designed to optimize the results of the bond process. The unit is also capable of utilizing specialized special-purpose fixtures. The versatility of UTC-475 provides the ability to modify the bond process to meet the specific demands of the application while still maintaining the highest quality bond results. Overall, SHINKAWA UTC-475 is a versatile and reliable ultrasonic bonder. Its high-intensity transducer asset, intuitive control model, flexibility, and variety of available fixtures make it an ideal choice for a wide variety of applications. Its superior flexibility allows for customizing the bond process to the exact requirements of the application while still maintaining consistent bond results. Additionally, its reliability and ease of use make it a dependable choice for many applications.
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