Used SHINKAWA UTC-5000 #293595762 for sale

SHINKAWA UTC-5000 is a high-performance bonder that is ideal for a variety of precision bonding applications. With a rapid bonding sequence, a wide range of materials and its excellent accuracy, this bonder is ideal for production in laboratories, research centers, and industrial applications. This model utilizes an ultra-fast 6-axis robot with a direct drive axis that facilitates motion control for accurate alignment of two components for reliable bonding. This allows for fast bonding sequences to achieve high throughput in precision bonding applications. SHINKAWA UTC 5000 provides the flexibility to work with various adhesive types, including die attach and conductive glue, as well as with a host of electronic assembly materials, including semiconductor packages and wafers. For enhanced accuracy, the bonding head is equipped with a vision system and touch sensing probe to ensure reliable positioning of the components during the bonding process. The bonder's intuitive user interface provides a visual guide to managing the process, with an intuitive menu providing quick access to the controls and settings. The touch screen control panel allows for quick setting up of the parameters for the bonding process, and for easy troubleshooting. UTC-5000 also includes a variety of safety features, including an enclosed cabinet that keeps dust and on-line usage from interfering with the vacuum system, as well as a set of active alarms that warn of improper process parameters and the potential of a bond failure. UTC 5000 is a versatile and accurate precision bonding system that is designed for demanding applications in cell manufacturing, medical device production, and other production processes. Its easy operation, wide range of materials and fast bonding sequences make it an invaluable tool for both R&D and manufacturing environments.