Used SHINKAWA UTC-5000 #293595766 for sale

SHINKAWA UTC-5000 is a high-performance bonder used for precise conductive bonding and soldering processes. This unit is designed for superior process control with precise temperature measurement, precise dispense rate and speed control, precise control of force, and process and part traceability. SHINKAWA UTC 5000 utilizes a high resolution force transducer for precision force control. This enhanced feature maximizes the accuracy of bond parameters, making the bond process more precise and consistent. It allows operators to monitor and control the process force at all times during the bond cycle. UTC-5000 also features a high speed, precise drive and precise controlling equipment with full-view optical microscope. Having an integrated drive system allows for precise controlling of the bond head, making the bond process faster and more consistent. The high-resolution microscope allows operators to capture external or internal patterns of the bonded parts at a higher magnification, providing greater control and accuracy of the bond process. Furthermore, UTC 5000 allows for process and part traceability. This unit is equipped with advanced monitoring systems to trace and record parameters including bond cycle time, bond position, and bond area. Operators can save parameters for future reference and are able to keep track of their past records. In addition, SHINKAWA UTC-5000's temperature control unit ensures that the temperature of the head does not go beyond the preset value, allowing for precise process control. SHINKAWA UTC 5000 is designed for superior process control with high precision and accuracy. It utilizes precise temperature control, precise force control, full-view optical microscope, process traceability, and a high speed, precise drive machine. UTC-5000 is ideal for advanced conductive bonding and soldering applications that demand superior process control with consistent results.