Used SHINKAWA UTC-5000 #293636619 for sale

SHINKAWA UTC-5000 bonder is a versatile advanced precision manufacturing platform designed for applications in the semiconductor, optoelectronics, and MEMS industries. Utilizing advanced thermal control and monitoring technology, SHINKAWA UTC 5000 bonder is capable of automated fine-pitch aluminum-to-aluminum bonds at high accuracy and speed. The sophisticated system reduces thermal shrinkage associated with other aluminum bonding techniques, allowing the usage of both standard and custom die formats. UTC-5000 bonder incorporates both ultrasonic and thermal heating for multiple combinations of application and process parameters. High-performance energy transfer highlights the device's unique capabilities, maximizing throughput and effectiveness for even the most delicate operations. The device also features SHINKAWA signature flushing recirculation system for a reduction of electrolyte leakage and increased overall component life. Various thermal profiles may be selected from the device's intuitive touchscreen interface. The ability to adapt quickly to dynamic operational changes is integral to the operation of UTC 5000, ensuring rapid transition between different processes and the correct usage of application-specific materials. In addition, a standard remote operating capability permits the device to function autonomously with minimal human intervention. SHINKAWA UTC-5000 bonder also integrates a series of software modules with insights on environmental conditions, process parameters, and part compatibility. A real-time data logger with event capture guides operators through the visual status report of the bonding process, assisting with real-time analytics and improving machine efficiency. Finally, SHINKAWA UTC 5000 bonder comes in multiple customization levels designed to meet industry requirements. Leveraging the expertise of both SHINKAWA and third-party partners, the device provides a comprehensive solution encompassing mechanical, electrical, and software systems for a variety of applications.