Used SHINKAWA UTC-5000 #9152125 for sale

SHINKAWA UTC-5000 is a high-performance wire bonder, designed to engineer ultra-high-performance connections for the most demanding applications. SHINKAWA UTC 5000 employs the latest technology including advanced motor controls and a high-resolution vision equipment, ensuring high-performance wire bonding with low thermal drift. UTC-5000 is a dual-head bonder featuring a "LaserMark" thermal process that enables the bonding of fine bonding wires using ultra-short pulse laser heating. It allows for the placement of gold, aluminum and copper wire with a pitch down to 0.1 mm. With up to 200 process steps, UTC 5000 covers the needs of most demanding applications. SHINKAWA UTC-5000 also features advanced motor controls for high-accuracy and repeatability in the placement process. The motors are based on direct-drive positioning systems with a high-performance 32-bit microprocessor. This enables fast and accurate bonds with very low settling time and low thermal drift. The bonder also includes a high-quality video detection system, providing automated wire placement and increased production line efficiency. The camera-based unit supports both bright-field and dark-field detection, as well as advanced features such as wire inclination control for accurate bonds and automated teaching of bond parameters. Finally, SHINKAWA UTC 5000 is equipped with a built-in monitoring machine, allowing the operator to monitor the condition of both the machine and the bonding process in detail. The tool is also capable of detecting the presence of unsuitable materials, as well as wire breakage. In conclusion, UTC-5000 is a high-performance wire bonder that combines advanced motor controllers and a high-resolution vision asset with "LaserMark" thermal process. It is designed to securely and reliably bind high-performance wires with a pitch down to 0.1 mm and can automate the placement of wire with the help of a built-in camera-based model. Furthermore, it monitors the condition of both the machine and the bonding process, making it a reliable solution for the most demanding applications.