Used SHINKAWA UTC-5000 #9261678 for sale

SHINKAWA UTC-5000 is a top-of-the-line precision ultrasonic bonding equipment designed to achieve robust joining of advanced materials and components. The system offers excellent electrical and mechanical bonding characteristics, superior repeatability, and a broad range of process capabilities. SHINKAWA UTC 5000 features a highly precise positioning unit for laminating sheets and multi-level substrates, as well as a versatile XY table for scanning and pressurization. The accurate and repeatable placement of laminates ensures fast and reliable bonding. The pressurization unit is equipped with a precision pressurization mechanism, allowing the user to adjust pressure to the needs of the process and to accurately repeat the results. The ultrasonic transducer is the core of the unit, offering advanced technology with high-precision power control. By adjusting the applied power of the transducer, it is possible to obtain the desired hermetic seal while controlling the output characteristics of the joint. The transducer also provides excellent repeatability and stable operation over time. UTC-5000 feature's advanced control systems that allow precise setting of the energy ratio between the before and after cycles, which is key to precise and repeatable bonding results. The settings can be adjusted for each application, allowing the user to fine-tune the process to meet the requirements of many different materials and components. The machine also offers quick reaction time, which makes it suitable for high-volume applications. UTC 5000 tool is easy to integrate with other equipment due to its open architecture, modular design, and available interfaces. It is also designed to be user-friendly, with intuitively easy operation, full parameter information tracking, and monitoring for immediate process analysis. The combination of its features and technical specifications make SHINKAWA UTC-5000 an excellent choice for a wide range of applications.