Used SHINKAWA UTC-5000 #9261685 for sale

SHINKAWA UTC-5000 is a state-of-the-art highly reliable and controllable wire bonder. It is a semiautomatic tool designed for high-precision soldering and for placing and bond protruding thermal bumps on many types of substrates. SHINKAWA UTC 5000 is composed of two main parts: a head and a controller. The head consists of the bond tip, bonding wire, vision optical system, XY stage and Z-axis stage. The wire is fed from a spool and transported to the bond tip. The XY stage enables adjustment of the bond angle and distance between two components. The Z-axis stage can be used for precision adjustment of the bond height and for pressure application. The vision optical system helps with wire positioning, as well as recognizing and pinpointing the proper bond locations on substrates. The controller is the main interface and operating unit of UTC-5000. This is where user settings and parameters are adjusted. The controller includes a touch panel display and a graphical user interface (GUI). This GUI enables on-screen operators to set up and run the bonder. Users can select the bond speed, bond pressure, wire feed and breakable force. In addition, visual programming can be used to create the program for repeatable operation. UTC 5000 is a reliable and sophisticated wire bonder that has high throughput and is suitable for a wide range of applications. It is available in a benchtop and floor model, and is designed for easy integration into automated production lines. Thanks to its configurable parameters, advanced design and high accuracy, SHINKAWA UTC-5000 is an ideal tool for multiple high-precision soldering applications.