Used SHINKAWA UTC-5000 #9261686 for sale

SHINKAWA UTC-5000 is a high-precision bonder that is designed for the reliable production of precision-controlled microelectronic assemblies. It is a fully automated thermosonic bonding equipment aimed at delivering the highest level of consistency and accuracy for every application. The bonder is able to accurately identify even minute changes in bond parameters, keeping the process under continuous control and providing minimum bond-to-package variation. SHINKAWA UTC 5000 is equipped with an advanced ultrasonic transducer which utilizes the combination of power and frequency to provide an accurate outcome. It has a wide range of frequency range and power which can be adjusted in accordance with the requirements of the application. The bonder is also equipped with an advanced image-processing unit for fine-grained control of the bonded area. The system is also compatible with several types of substrate materials, making it suitable for a wide range of applications. The unit can be programmed with high-level operating commands and is capable of controlling the thermosonic process with great precision. The machine can handle several applications simultaneously, including micropotting, wedge-bonding, lead-bonding, and die-attach. The weld quality is also monitored, providing real-time instant feedback and allowing for quick and easy adjustment of the process parameters to ensure optimal outcomes. UTC-5000 is also equipped with various safety features, which include an emergency stop button, a pressure relief valve, and over-temperature protection. The tool is designed to deliver the highest quality results with reduced costs and improved production throughput. It is also designed to provide a safe environment and provide users with all the necessary operational and maintenance support.