Used SHINKAWA UTC-5000 #9363117 for sale

SHINKAWA UTC-5000 is an innovative ultrasonic wire bonder designed to offer smooth and efficient operation for the assembly of microelectronic components. This high-efficiency bonder is capable of achieving bonding speeds of up to 1000 bonds/minute with an accuracy of 1 micron. SHINKAWA UTC 5000 is engineered to handle thin and ultra-thin bonding wire ranging in diameter from 0.08mm to 0.3mm. The equipment is equipped with an advanced motion control equipment, consisting of a high-speed X-Y-Z linear motor. This allows for a rapid acceleration and precise positioning and movement of the bonding tip to any desired location by an operator. The bonded wire is secured by an effective clamping mechanism to prevent wire slippage during operation. UTC-5000 is equipped with a modern monitoring system for an effective performance of the bonder. The unit consists of a two-dimensional image sensor, mounted on a ball bearing, which can detect the contact between the bonding tip and the bonded wire and can detect the end of the bonded wire. This sensor assists in the monitoring of wire bonds per wire and total bond count. Additionally, this monitoring machine can also provide information about the uptake rate, tamp velocity, and other factors during the bonding process. The UTK-5000 bonder also boasts a wide range of adjustable parameters, allowing an operator to quickly adapt the equipment to specific product requirements. These settings include temperature control, pressure adjust, and wire feed speed. The bonder can also be programmed to bond different wire shapes such as flat, loop, and zigzag at various speeds. UTC 5000 is also highly reliable and robust thanks to its hardened frame and dust preventative construction, meaning it can operate in production environments without interruption. The bonder also boasts a comprehensive safety tool which helps to protect both the operator and the bonded objects against any potential electrical or thermal incidents. In conclusion, SHINKAWA UTC-5000 is an efficient, reliable, and safe ultrasonic wire bonder designed to suit a wide range of applications, providing high-quality and consistent results.