Used SIEMENS Siplace A2 #293637451 for sale

SIEMENS Siplace A2 is a fully-automated, high speed bonder capable of moving and bonding parts with a wide range of sizes and materials. It is suitable for a variety of industrial and consumer applications and is the best choice for most demanding bonding tasks. Siplace A2 has a PCB alignment speed of up to 140 cm/s and is capable of rapid and accurate alignment of multiple boards. It features a high precision placement head which can be adjusted to a wide range of heights, ensuring a high level of accuracy and repeatability. Furthermore, the placement head can be adjusted to different angles, which allows for placement of several different parts with differing orientations. SIEMENS Siplace A2 is equipped with a variety of bonding techniques such as soldering, press-fit and glue. Soldering can be used for a variety of components, including packages, QFN chips, capacitors and resistors. For press-fit and glue, the machine can be adjusted to precisely bond parts with different sizes and shapes. Siplace A2 comes with a number of extras that make it suitable for most demanding tasks. These include an automated board pre-alignment station which lets the bonder work on multiple boards in parallel. Additionally, it features an adjustable pressure system that can be adjusted to suit the different shapes and sizes of the parts being bonded. The temperature of the soldering iron can also be controlled to a high degree, ensuring that parts are heated to the required temperatures without overburning. In addition, SIEMENS Siplace A2 is equipped with error reporting systems. In the case of an error during the bonding process, the machine is able to detect the issue and send an alert to the operator. This alert includes the details of the error on the board, allowing for quick and effective troubleshooting. Overall, Siplace A2 is a quality bonder which offers fast and accurate placement of parts with a wide range of sizes and materials. It is suitable for a variety of industrial and consumer applications, and is the best choice for most demanding bonding tasks.