Used TDK AFM 1506 #293630329 for sale

TDK AFM 1506 Bonder is a high performance automated flip chip bonding equipment. The system is designed to be used in a range of industrial applications, including automating the production of PCBs, electronic assemblies and paper substrates. It is equipped with a high-speed die-lifting arm, allowing for seamless flip-chip packaging. The unique die lifting arm has a 50mm clearance to enable the package to be flipped over at an angle. The unit also features a high-performance vision machine for precise bond placement, and can monitor both bond quality and bond position. This ensures that each die is accurately placed, even when working with extremely fine-line features. Additionally, the bonder can be programmed to implement ball placement, and can combine different technologies such as wire bond, solder ball and flip-chip in the same assembly. The tool boasts a 3-dimensional x, y and z-axis stage with a high-precision capacitive sensors and stabilization feature, ensuring that production is kept to extremely accurate tolerances. The x-axis can move at up to 1500mm/s, and the y-axis allow for accurate die placement head of up to 1000mm/s. The on-board robotic vision asset allows for both off-line programming and on-line correction of die placements if needed. The vision model can also detect the flip angle so that the die is correctly oriented before being welded. Furthermore, AFM 1506 Bonder includes real-time data tracking, allowing the user to investigate the causes of any production errors. Additionally, it includes several safety features, such as emergency stop functions, that help to protect both the operator and the machine. TDK AFM 1506 Bonder also includes a number of peripheral devices, such as an industrial touchscreen for step-by-step instructions and a monitoring interface, an ergonomic keyboard and 4-axis adjustment screws. AFM 1506 Bonder is an innovative, automated assembly equipment that provides a production solution for a variety of industries. Its high-speed die-lifting arm, powerful vision system and host of peripheral devices make it an indispensable tool for high-precision PCB assembly.