Used TDK AFM-1550 #9396552 for sale

TDK AFM-1550
Manufacturer
TDK
Model
AFM-1550
ID: 9396552
Vintage: 2010
Flip chip bonders 2010 vintage.
TDK AFM-1550 is a high performance, full-featured bonder designed for precision handling of various challenging operations in the assembly and packaging processes of semiconductor and electronics fabrication. It is capable of handling a wide range of bonding applications including flip chip, component attachment, wire bonding, and die attach. Its flexible design allows it to accommodate large panels or substrates, and the temperature is adjustable to suit the application. The bonding technology used in AFM-1550 makes it suitable for yielding high levels of precision and reliability. TDK AFM-1550 is built on a modular platform for ease of integration in a production line. It ensures reliable bonding operations with the use of a large range of advanced process control functions such as parameter setpoint control, user-defined recipes, and data logging for process traceability. It further integrates with higher-level automation systems via the industry standard communication protocol. The modular design of the equipment enables fast external access to its internal components allowing for the rapid changing of parts and maintenance procedures. It also offers a highly sophisticated digital vision system for ultra-precise detection and alignment of components, enabling consistent production of high-quality parts. AFM-1550 includes a sophisticated control unit which enables operators to easily set up the bonder for automated and multi-process runs. It provides a quick verification of compliance with process parameters through its built-in process diagnostic feature and overall monitoring of production data. TDK AFM-1550 further includes a real-time monitoring machine designed to detect process deviations before they occur and promote operator confidence. This feature further supports process optimization and traceability of machine performance. Overall, AFM-1550 is a high-performance bonder that can produce highly reliable, high quality bond processes and components in the semiconductor and electronics fabrication industries. Its flexibility, accuracy, and reliability guarantee its longevity for services in many industries for years to come.
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