Used TDK AFM-25 #9352215 for sale

TDK AFM-25 is a high-performance, precise die bonder designed to provide an efficient, all-in-one solution for advanced flip chip and die assembly processes. This flexible, self-contained equipment features a unique, automated bonding process, precise alignment and robust handling of fragile components, allowing it to minimize component damage and improve yield. AFM-25 provides a number of advanced features, such as their patented FlipChip Active Bonding, which allows for simultaneous thermo-compression and thermosonic die bonding. With its precise Z-axis control, fine alignment accuracy, and the ability to accurately and dynamically adjust bond force parameters, this system is ideal for alternating between both soft and hard bonding. The unit also runs on a modular design, which means it provides the flexibility to use a variety of die sizes, from the smallest 01005 up to the largest 200x240 mm. The machine also includes a convenient graphical user interface to maximize programming ease. The tool utilizes precision XYZ linear stages, equipped with high force servo control, offering reliable and accurate operating performance with high repeatability. TDK AFM-25 also has a built-in vision asset, which provides the capability to recognize die markers, as well as for die and substrate exterior inspection. The model is also equipped with a high-speed laser equipment, which optimizes die placement accuracy in a fraction of the time of conventional methods. This exceptional system is also compliant with a variety of standards, including ISO 90012008, IPC 9702, ISO/IEC 61210, CE, and RoHS. The unit complies with a variety of international environmental standards, and is designed with safety features to ensure user protection. AFM-25 is the perfect automated die bonding solution for advanced flip chip and die assembly processes.