Used TEL / TOKYO ELECTRON Synapse V #9269005 for sale
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ID: 9269005
Coater system
Adhesive dispense lines:
(2) Pump dispense lines
N2 Pressure dispense line
Adhesive delivery container type:
1 Liter bottle for pressure tank
1 Liter nowpak for pump dispense lines
High viscosity adhesive line: 0.3 MPa (for up to 10,000 cp)
Low viscosity adhesive line: 0.2 MPa (for up to 100 cp)
Solvent cabinet:
20 Liter pressure tanks:
(2) Containers switchable online
(2) Containers backup
Bevel rinse: (2) Nozzles
Back rinse: (2) Nozzles
EBR: 0.7-35 mm to ±0.3 mm
Spin speed: 0-4000 rpm to ±1 rpm
Dispense head control: Programmable position including dynamic dispense
Atmosphere hotplate: Up to 350°C ± 2%
N2 Hotplate: Up to 350°C ± 2%
Cold plate: (2) Cooling plates controlled by process cooling water
Drain tank:
10 Liter drain tank for nozzle bath
10 Liter drain tank for spin cup.
TEL / TOKYO ELECTRON Synapse V is a state-of-the-art wire bonder, designed to make the processes of bonding and attaching components more efficient and reliable. This high-speed, high-resolution bonding equipment incorporates advanced fire-and-forget technology to allow operators to program and leave up to thirty programs in memory. With programmable bonding parameters, multiple bonding modes, a very small footprint, and intuitive user interface, TEL Synapse V is ideal for production line applications. TOKYO ELECTRON Synapse V utilizes a specialized wire feeder design, and a unique wire driving system, with the ability to handle both gold and aluminum wire, for ultra-flexible configurations. With a maximum speed of 5.0 m/sec, Synapse V is capable of bonding a variety of wire sizes (including 0.1mm, 0.25mm, 0.3mm, 0.5mm, 0.8mm, 1.0mm and 1.25mm). Additionally, this bonder provides a highly precise temperature control unit, with ±1℃ accuracy, for consistent, high-quality results. TEL / TOKYO ELECTRON Synapse V also features a broad range of interchangeable nozzles and precision placement optics, allowing for uninterrupted production when switching between different substrate applications. The nozzle selection ranges from small flat surface nozzles to large, multi-row nozzles, with a total placement accuracy of ±0.13mm. The innovative 'turbohead' design allows the tool to be adjusted in three dimensions, giving the operator the ability to adjust the height, width, and angle for optimal performance. This advanced bonding machine is tailor-made for commercial applications, with an ergonomic design for simplified operation, making it easy to program and use. Equipped with a top-of-the-line sweeping sensor, the boomerang arm of this wire binder allows for precise placement in even tight spaces, with a resolution setting of 0.5mm. In addition to having a small overall footprint, it also includes an integrated power supply, optional electrical testing, and production data e-mailing capabilities, making this bonder an ideal choice for high output production lines. TEL Synapse V is an efficient and accurate tool that is sure to exceed your bonding expectations. This versatile bonder provides high-speed performance, excellent component placement, and dependable results, resulting in greater efficiency, higher speed, and lower costs for your production line. With a high-tech and user-friendly design, and host of customizable features, TOKYO ELECTRON Synapse V wire bonder is the ultimate tool for any electronic component application.
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