Used TEL / TOKYO ELECTRON Synapse V #9269007 for sale
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ID: 9269007
Bonder
Pressure: 49 kN
Temperature: 200°C
Vacuum level: 30 Pa
Alignment: X, Y: ±30 µm, Θ ±0.02°.
TEL / TOKYO ELECTRON Synapse V is a high-end, single-section bonder used for microelectronics assembly, interconnect, and 3D packaging. TEL Synapse V can complete multiple process steps in one operation, significantly boosting throughput in IC packaging and component mounting. The machine includes a high-resolution optical imaging system with an auto-job-set feature, a high-velocity precision wire heating system, advanced vacuum press technology, and direct imaging. TOKYO ELECTRON Synapse V is a variable-temperature, batch-type bonder that is ideal for product manufacturing and process development. It has a flexible, multi-mode system that provides users with the ability to choose between manual and semiautomatic modes. The simplified operator interface makes programming easy and efficient, while the advanced safety features enable reliable, hazard-free process control. Synapse V bonder integrates surface mount technology (SMT) with fine-pitch component placement, enabling the assembly of multi-layer packages with low profile, and tight pitch connections. With a high-resolution camera that can scan and view component locations, the bonder precisely inspects every component to ensure proper connections. Direct imaging technology eliminates the need for solder paste and stencils, and the machine is able to bond solder-free connections, reducing manufacturing costs. TEL / TOKYO ELECTRON Synapse V also features an auto-job-set feature that can automatically adjust the distance between wirebonds and the package size, improving accuracy and reducing process time. The integrated mechanical bonder head enables consistent wirebond loop height and dependable stability. The max wireless bond number is 12 and the wire stretch length is 8mm to 40mm. TEL Synapse V is designed with the user in mind, with a full-colour touch screen and programmable operating parameters, it provides complete control over temperature, force, speed, and wirebond programs. This ensures a consistent quality of workmanship and a powerful platform for process development. TOKYO ELECTRON Synapse V is a powerful, reliable, and efficient machine for automating microelectronics assembly and 3D packaging, making it an ideal option for large-scale product manufacturing.
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