Used TEL / TOKYO ELECTRON Synapse Z #9269008 for sale

TEL / TOKYO ELECTRON Synapse Z is an advanced die bonder that was specifically designed for the semiconductor industry and provides a combination of speed, accuracy, and flexibility for die bonding operations. In order to maximize throughput while minimizing contamination, TEL Synapse Z is constructed with a closed-loop control system and is capable of performing multiple optical, electrical, and thermal operations at extremely high speeds. The unit has a 12"x12" working area which is suitable for bonding a wide range of die sizes including CSP, QFN, LGA, and BGA devices. The unit is equipped with two high-resolution cameras, enabling vision pattern recognition with 0.05µm resolution accuracy for the precisely aligned placement of die on the substrate. TOKYO ELECTRON Synapse Z also features a rotational stage with 5k rotation accuracy. During the bonding process, the thermal head is capable of achieving temperatures up to 700°C for a maximum bonding temperature of 2271°C. This is accomplished by a 5.5-second temperature rise heating function and an adjustable cooling rate for a more robust die bonding process. The unit is also equipped with multiple programming features for flexibility and expedited process optimization. Synapse Z has pre-set processing programs, which can be further modified via the user friendly programming system, allowing for the optimization of bonding parameters. The system can store up to 999 programs, allowing users to easily switch between them to efficiently handle different parts or to adjust to changing environmental conditions. Finally, TEL / TOKYO ELECTRON Synapse Z comes with an integrated statistical process control (SPC) that offers the user multiple analytical data collection tools to monitor the operation. This provides an accurate record of the process, allowing for proactive optimization and high-volume quality assurance. With these features combined, TEL Synapse Z allows for short cycle times, reduced waste, and superior bonding performance in high-volume production lines.