Used TEL / TOKYO ELECTRON Synapse #9235508 for sale

TEL / TOKYO ELECTRON Synapse is an advanced wire bonding equipment for the manufacture of leading-edge semiconductor components. TEL Synapse wire bonder is specifically designed for high-volume production. It automates the process of creating gold and aluminum wire bonds at various set-points for a variety of microprocessor and electronic package types. TOKYO ELECTRON Synapse wire bonder features a 5-axis X-Y-Z bond head motion system, with an integrated vision unit for part recognition and alignment. The X-Y-Z motion is characterized by its high speed and accuracy, with movement made in the nano-second range for faster individual wire bonding performance. The X-Y-Z bond head motion machine is also equipped with a precision wire feed and height control tool, allowing it to maintain precise placement and orientation of the wire while keeping it centered in its work path. Synapse wire bonder also features a temperature regulated bonding chamber, which helps in maintaining a consistent temperature within the bonding room. This helps to ensure the physical and electrical properties of the wires remain consistent during the bonding process. The chamber is also equipped with three-dimensional motion control for finer alignment of the bond heads. For bonding process control, TEL / TOKYO ELECTRON Synapse wire bonder offers a number of different functions for optimizing the process. This includes auto-tune function for setting the industrial parameters of the bonding process; wire monitoring to constantly check the integrity of the bonding process; and self-diagnosis for evaluating and notifying the user of any abnormalities. It also features a user control program which allows a user to customize the bonding process parameters, making it suitable for a variety of applications. To ensure consistent quality of the finished product, TEL Synapse wire bonder offers a multi-level quality control asset, which includes optics verification of wire positions, size, and alignment. It also offers distortion data analysis to ensure proper wire exsertion and contact failure control. This model provides higher yields and improved productivity. TOKYO ELECTRON Synapse wire bonder provides a reliable solution for the manufacture of complex semiconductor devices with an extremely fast turn-around time. Its advanced software and superior hardware have been specially designed to meet the challenging demands of leading-edge technology.