Used TI TIB-810 #9392742 for sale

The Thermco TI TIB-810 is a thermocompression bonder designed to accommodate a broad range of die sizes and a wide variety of applications with a superior level of reliability. This bonder utilizes a patented baseplate that includes a unique design which allows for easy manipulation and the additional security of adjustability. TIB-810 provides users with a choice of three standard configurations—including single-step die attach, flip chip bonding, and wafer bumping. The single-step die attach system offers fast bond attachment times for electrical component assembly. The flip chip bonder allows for the placement of large area dies and the installation of surface mount components for applications in the flat panel display market. The wafer bumping feature utilizes electroplated bumps for superior uniformity and connection consistency. The machine is equipped with an intuitive graphical interface and advanced automation capabilities, offering a user-friendly experience. A wide range of functions is also available through the use of mechanical tool kits, enabling it to be easily adapted to different process needs. Temperature control parameters are adjustable to meet different application needs. Variable platen and stage movement provides instantaneous speed control, giving the user flexibility and control over the process. In addition, TI TIB-810 also provides the capability to create a unique image of each die before and after the bond procedure. This can be used for product optimization, process improvement, and other quality assurance purposes. The image logging feature of the machine also enables storage of statistical data for improved tracking and performance analysis. The product is designed for an effective, efficient, and economical solution for a wide variety of thermal bonding needs. Its robust features make it ideal for manufacturers in a wide range of industries where size reduction, reliability, and process control are essential. Moreover, TIB-810's advanced microprocessor and flexible adjustment parameters enable it to remain agile and advantageous over a variety of different processes.