Used TOKYO OHKA KOGYO TWM 12262 #293615165 for sale

TOKYO OHKA KOGYO TWM 12262 is a production grade bonder designed for precision micro-assembly applications. Utilizing its Patented Small PTC Bond Technology and automated wire bonding process, the bonder offers a reliable, efficient and cost-effective way of producing high-quality products in high-volume production environments. TWM 12262 is a compact and perpendicular bonder, offering a convenient and space-saving solution for mid-to-high volume applications. This model is capable of precision micro-assembly of high-reliability components and multipoint applications and can be integrated with a variety of other bonders for higher productivity and reliability. TOKYO OHKA KOGYO TWM 12262 has an adjustable template size up to 4.0mm wide and 8.0mm long. It has an enhanced bonding speed of up to 5.5 seconds/bond and a bond pitch range of 25 - 150um. TWM 12262 can be integrated with a high-end system such as the Otsuka Wafer Handler BHT 1000, providing automated features such as pick-and-place, wire bonding, and optical inspection to maximize throughput and dependable assembly. It supports various wire types including Aluminum, Copper, Bonded Copper and Aluminum coated Copper. The bonder also features a Bond Strength Monitor, allowing it to easily and accurately measure the power applied to the bond head and bond strength. Additionally, the Transparent O-rings provide a dust- and humidity-proof bond surface, as well as an easy-to-read thermocouple, preventing oxidation and ensuring reliable bonding. TOKYO OHKA KOGYO TWM 12262 is ideal for high-end and high-reliability assembly applications. Its robust design, high performance, and intuitive operation make it perfect for not only small scale production, but also scalable production environments. It's a reliable solution for product engineers looking for precision micro-assembly in a reliable, cost-effective tool.