Used TOKYO OHKA KOGYO TWR 12262 #9329059 for sale

TOKYO OHKA KOGYO TWR 12262
Manufacturer
TOKYO OHKA KOGYO
Model
TWR 12262
ID: 9329059
Wafer Size: 12"
Vintage: 2012
Wafer debonding machine, 12" Silicon wafer from carrier plate with low stress 2012 vintage.
TOKYO OHKA KOGYO TWR 12262 is a bonder from TOKYO OHKA KOGYO (TOK) which provides high precision bonding solutions. This product is a TAB/SMT Bonder, which stands for Tape Automated Bonding/Surface Mount Technology Bonder. This bonder is designed to apply force to a workpiece with a combination of heat and pressure, securing and joining components together with speed and accuracy to ensure precision manufacturing results. TWR 12262 has a repeatability of ±0.01mm and a bond force range of 0 to 40 Newton force. This dual function equipment allows for reliable precision bonding with accuracy of speed and pressure, and improved surface contact. It also features programmable placement time ranging from 0.2 millisecond to 3.5 millisecond, allowing for fast and precise placement of components with ease. This ensures minimal misalignment of components and reduces failure rates. This means that products produced with this bonder are safe and of superior quality. TOKYO OHKA KOGYO TWR 12262 functions with two types of soldering methods- on-chip and off-chip soldering. These methods allow for better contact between components and also eliminates air bubbles. The unit can handle a wide variety of substrates including FR4, Kapton, and Teflon, as well as a range of substrates such as glass, polyimide, and metal. The bonder also features adjustable temperature settings, allowing users to manipulate the temperature of the bonder to suit the substrate that is being used. TWR 12262 is equipped with a multi-point vision system, allowing for precise positioning of small parts. This multi-point vision unit also enables the machine to accurately detect and inspect components during a bonding process, allowing for quick and imprecise process adjustments on the fly. This provides superior control over process variables, ensuring more efficient end products. TOKYO OHKA KOGYO TWR 12262 is designed to provide maximum product yields in a minimal processing time, while maintaining the highest standards of product safety and quality. This bonder also features an automated force control machine, which allows for consistent and repeatable bonds. Using this innovative tool, users can achieve fast and accurate bonding of components in a single pass, ensuring that the end product is up to specification and of the highest quality.
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