Used TORAY FC 1000 #9036508 for sale

TORAY FC 1000 is a high performance, multi-purpose automatic bonding equipment designed for wire bonding and other related tasks. The system features a quick cycle time, offering users the ability to meet customers' technical requirements and reduce time to market. FC 1000 provides superior wire bonding performance with a broad range of wire sizes and types. The unit is constructed with an integrated and automated wire feeding machine, providing precise and repeatable bonding results even on small lead pitch sizes. The advanced algorithms utilized by the integrated tool combine to offer optimized and consistent results. The asset is fully programmable, allowing for enhanced flexibility in the production environment. In addition to providing superior performance in the area of wire bonding, TORAY FC 1000 is also capable of performing other types of bonding operations, including solder bonding, thermal compression and insulation displacement bonding (IDB). All of these operations require precision placing of components at specific locations. The quick cycle time of FC 1000, combined with its accuracy, make it capable of meeting production requirements. The model is equipped with an optical alignment feature that allows for precise placement of components and alignment of parts prior to the bonding operation. This ensures that the components set up for the bonding operations are in the correct position and that the bonding operation itself will be repeatable with each use. TORAY FC 1000 is also equipped with a multi-line wire feeding equipment, allowing it to accommodate a variety of wire sizes and types. Each wire is fed independently, resulting in improved throughput rates and less downtime. The system is also equipped with a vacuum unit that ensures the uniform distribution of wire between the various spools for reduced wire breakage and improved handling. Finally, FC 1000 features a user-friendly interface, allowing users to quickly familiarize themselves with the machine and manage the bonding operations with ease. It is designed for minimal maintenance with accessibility to the internal components, allowing users to quickly identify any problems and repair them quickly and easily.