Used TORAY FC 3000 #9372762 for sale

TORAY FC 3000
Manufacturer
TORAY
Model
FC 3000
ID: 9372762
Flip chip bonder.
TORAY FC 3000 is an automated, digitally-controlled hot melt adhesive bonding equipment designed for use in substrate handling applications. Using an advanced, self-learning motion control system, the unit is capable of bonding a variety of substrates with high accuracy and speed. FC 3000 is suitable for a wide range of applications, including optical devices, semiconductors, LEDs, displays, sensors and more. TORAY FC 3000 is equipped with an advanced thermal machine with a stability of +/-0.2 ºC, allowing for precision melts of hot melt adhesive compounds. The tool is capable of bonding up to 6 substrates within a single process cycle, achieving different bonding adhesives and adhesion strengths depending on the application. An integrated vision asset enables the model to identify precise bonding locations, enabling high precision bonding. FC 3000 is able to store up to 50 process programs and offers support for custom programming, allowing for customization for various bonding applications. Achieving cycle times of 2.5 seconds per bond, the equipment is fast and efficient in various production speed requirements. The system also offers comprehensive process data logging, allowing for centralized monitoring and recording of production data from a remote location. In addition, TORAY FC 3000 is equipped with a user-friendly, easy-to-use graphic user interface. With a touch panel operator console, operators can easily control the unit with easy-to-understand navigation menus and customizable parameters per application. Overall, FC 3000 is a reliable and robust bonding machine with superior accuracy and speed. With precision melts and higher substrate precision, as well as easy-to-use controls and custom programming, the tool is suitable for a wide range of adhesive bonding applications.
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