Used TORAY FC 3000 #9393318 for sale

TORAY FC 3000
Manufacturer
TORAY
Model
FC 3000
ID: 9393318
Flip chip bonder.
TORAY FC 3000 is a fully automated bonder designed for the advanced application of precision bonding for extremely small, low-temperature substrates. It is a flexible and versatile equipment that integrates the highest level of precision technology for the most demanding applications. The system is precision tuned for the demanding needs of substrate bonding applications such as die bonding and MEMS packaging. The unit consists of a fully automated bonding head, a control unit, a micro-vision machine, and an articulated robotic arm with force feedback capability. The tool is capable of providing repeatable bond repeatability and accuracy up to 0.2 µm. It also provides a wide range of bonding capabilities including manual or automated Thermal Compression Bonding (TCB), Ultrasonic Bonding (UB), and Die-Attach (DA). FC 3000 is equipped with a unique vision asset that accurately locates the exact position of each component in the bonding area through the utilization of 3D imaging. This allows the model to accurately align and position each part for perfect bonding. The vision equipment also eliminates the possibility of potential misalignment of components due to thermal expansion and other external factors. TORAY FC 3000 has a highly efficient bonding process, allowing for precise control of the process. The system is designed to eliminate any possibility of contamination of the substrates due to external air contact or other sources. The bonder works in an fully enclosed environment, with temperature control and adjustable positive pressure for optimal performance and yield. The unit also includes a variety of safety features such as an emergency button and door locks for operation in hazardous working environments. It is fully capable of operating in temperatures ranging from -50°C to +250°C, making it suitable for all low-temperature bonding operations. The machine is highly reliable and robust, providing a long operating life and maintenance-free operations. The tool also includes easy to use software features which allow users to customize their bonding processes to meet specific requirements. In summary, FC 3000 is the ideal choice for high-precision bonding processes, offering excellent repeatability and accuracy in a fully automated, cost-effective asset.
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