Used TORAY FC 3000L2 #9289464 for sale

TORAY FC 3000L2 is a state-of-the-art bonding machine designed for automated bonding applications. The machine is equipped with an intuitive control equipment and an intelligent visual measurement system. It is suitable for a variety of packaging and semiconductor applications, including TAB bonding, wafer bumping, and microelectromechanical unit (MEMS) bonding. FC 3000L2 has a generous working area of up to 8" x 8", allowing for a greater variety of products to be bonded. The wafer clamping and registration systems are designed to ensure precise alignment of the wafers. The automatic recognition of edge exclusion areas helps ensure accurate positioning. The wafer-to-wafer positioning methods can be adapted to various criteria such as packaging assemblies, surface finish, and material. TORAY FC 3000L2 is capable of bonding various material types, including solder bump, gold, copper, aluminum, and lead-free. The advanced heat controlling machine helps maintain high accuracy and uniformity of the process in the bonder. Temperature monitoring is accomplished through an advanced pyrometery tool. Pressure, speed, and placement of the bonding head are also precisely controlled. The machine is able to run multiple types of processes, including wedge bonding, heated wedge bonding, tunneling, and thermocompression. The programmable touchscreen interface makes it easy to customize bonding recipes for different applications. Additionally, the machine can interface with a wide range of external devices, including 3D scanners, vision systems, barcode readers, and Ethernet for real-time process monitoring. FC 3000L2 is an innovative and reliable bonding machine that provides users with an efficient and high-precision solution for a variety of automated bonding processes. Its advanced features, such as computer-aided control of process parameters, make it an attractive option for industrial settings. It offers a robust and easy-to-use bonding solution for a broad range of application requirements.